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SK hynix showcases advanced memory products including HBM4 at Nvidia GTC 2026

Published: 17 Mar. 2026, 05:30 Updated: 17 Mar. 2026, 15:08

LEE JAE-LIM
[email protected]

SK hynix's sixth-generation high bandwidth memory (HBM4) chips are displayed at SEDEX 2025, a semiconductor exhibition, held at southern Seoul's Coex on Oct. 22, 2025. [YONHAP]

SK hynix showcased a broad range of its advanced memory products — including its sixth-generation high bandwidth memory (HBM4) — at the Nvidia GTC 2026 technology conference, which opened Monday in San Jose.

SK hynix's HBM4 is expected to be supplied to Nvidia's Vera Rubin platform. However, the product has not yet completed the U.S. company's final qualification process — a rigorous testing stage required before chips are approved for large-scale deployment. According to multiple reports, SK hynix recently delivered final HBM4 samples to Nvidia for verification.

At the exhibition, the company also displayed HBM3E and Socamm2, the second-generation system-on-chip advanced memory module, alongside HBM4. Demonstrations at the booth illustrated how these memory technologies are integrated into Nvidia's GPUs.

SK hynix also presented a liquid-cooled enterprise solid-state drive co-developed with Nvidia. Liquid cooling helps data center storage devices manage heat more efficiently as computing workloads grow more demanding.

In addition, the company's booth displayed DGX Spark, an AI supercomputer from Nvidia equipped with SK hynix's LPDDR5X memory, which is designed to deliver high performance while maintaining lower power consumption.

SK Group Chairman Chey Tae-won and SK hynix CEO Kwak Noh-jung are also expected to attend GTC 2026, where they will meet with global technology companies to discuss potential long-term partnerships and cooperation in AI infrastructure, the company said.

BY LEE JAE-LIM [[email protected]]