Samsung Electro-Mechanics, LG Innotek projected to top 1 trillion won in operating profit Samsung Electro-Mechanics and LG Innotek are emerging as unexpected winners in the AI era as they rapidly strengthen their presence in the supply chain for advanced semiconductor substrates used in GPUs and AI servers. 2026.5.28
Samsung Electro-Mechanics develops tiny new substrate for connected cars Samsung Electro-Mechanics has developed an automotive semiconductor package substrate tailored to driving assistance systems, in a move that extends the usable range of chip products for cars. 2023.2.27
Korean chip packaging to be shown at KPCA 2022 Korean companies will show the newest semiconductor packaging technology at an annual trade show on Wednesday, as techniques grow more important in improving the performance of high-end chips. 2022.9.20
Samsung Electro-Mechanics bets big on its chip substrates What Samsung Electro-Mechanics is eyeing in particular is a flip-chip ball grid array (FC-BGA) substrate, a sophisticated type of chip substrate designed to bind together high-performing processors used in computers and servers. 2022.7.18
Samsung Electro-Mechanics in talks with Tesla about cameras Samsung Electro-Mechanics is in talks with Tesla to supply camera modules, according to the Korean electronics component maker on Thursday. 2022.6.9
Samsung Electro-Mechanics invests in capacity expansion Samsung Electro-Mechanics invested 300 billion won ($247 million) to ramp up semiconductor package substrate capacity at its plant in Busan. 2022.3.21
Lee Jae-yong calls for Samsung to stabilize component supply Samsung Electronics Vice Chairman Lee Jae-yong called for the need to stabilize the supply of electric components produced by Samsung Electro-Mechanics in the face of growing demand. 2020.7.16
![A multilayer ceramic capacitor made by Samsung Electro-Mechanics [SAMSUNG ELECTRO-MECHANICS]](https://image.koreajoongangdaily.com/12532954.jpg?imageId=12532954&width=240&height=184&format=webp&format=jpg)
![The flip-chip ball grid array (FCBGA), an automotive semiconductor substrate, is one of the most challenging automotive parts to produce, according to Samsung Electro-Mechanics. [SAMSUNG ELECTRO-MECHANICS]](https://image.koreajoongangdaily.com/11386142.jpg?imageId=11386142&width=240&height=184&format=webp&format=jpg)
![Rendering of a Samsung Electron-Mechanics booth at the KPCA Show 2022 [SAMSUNG ELECTRO-MECHANICS]](https://image.koreajoongangdaily.com/11553650.jpg?imageId=11553650&width=240&height=184&format=webp&format=jpg)
![A Samsung Electro-Mechanics employee explains the manufacturing process of a semiconductor package substrate to journalists on Thursday at the company's production site in Gangseo District of western Busan. [SAMSUNG ELECTRO-MECHANICS]](https://image.koreajoongangdaily.com/10354269.jpg?imageId=10354269&width=240&height=184&format=webp&format=jpg)
![Tesla's Model 3 [TESLA KOREA]](https://image.koreajoongangdaily.com/11679821.jpg?imageId=11679821&width=240&height=184&format=webp&format=jpg)
![Samsung Electro-Mechanics' plant in Busan [SAMSUNG ELECTRO-MECHANICS]](https://image.koreajoongangdaily.com/10031065.jpg?imageId=10031065&width=240&height=184&format=webp&format=jpg)
![Samsung Electronics Vice Chairman Lee Jae-yong looks around the Samsung Electro-Mechanics production line in Busan on Thursday. [SAMSUNG ELECTRONICS]](https://image.koreajoongangdaily.com/10523925.jpg?imageId=10523925&width=240&height=184&format=webp&format=jpg)