Korea Joongang Daily
Korea JoongAng Daily

LG develops semiconductor solution that can reduce smartphone size, improve heat management

LG Innotek said Wednesday it has developed a next-generation semiconductor substrate technology that can reduce smartphone thickness while improving heat dissipation — a longstanding challenge in high-performance mobile devices.

2025-06-25

Samsung Electronics denies reports that it is entering glass substrate market

Samsung Electronics is entering the glass substrate market to enhance semiconductor technology. Other companies, including Intel and LG Innotek, are also pursuing this innovation.

2025-02-07

Samsung Electro-Mechanics develops tiny new substrate for connected cars

Samsung Electro-Mechanics has developed an automotive semiconductor package substrate tailored to driving assistance systems, in a move that extends the usable range of chip products for cars.

2023-02-27

Samsung Electro-Mechanics bets big on its chip substrates

What Samsung Electro-Mechanics is eyeing in particular is a flip-chip ball grid array (FC-BGA) substrate, a sophisticated type of chip substrate designed to bind together high-performing processors used in computers and servers.

2022-07-18