Vice foreign minister attends summit in Washington to discuss AI, chip supply chains

Kim Jina met with delegates from more than 20 partner nations at the Pax Silica Summit to talk policies to boost innovation and encourage fair cooperation.

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Vice Foreign Minister Kim Jina, third from right, attends the Pax Silica Summit in Washington held from June 25 to 26.

Vice Foreign Minister Kim Jina attended the Pax Silica Summit in Washington this week, where partner nations discussed cooperation in AI and semiconductor supply chains, the Foreign Ministry said Saturday.

The Pax Silica Summit is a U.S.-led strategic initiative and coalition of more than 20 partner nations dedicated to securing global technology supply chains.

On the first day of the second summit, held from Thursday to Friday and attended by countries including Australia, Finland, India, Japan and Britain, participants discussed intergovernmental and industry cooperation to build an ecosystem that facilitates AI innovation, the Foreign Ministry here said.

The second day focused on policy efforts to bolster AI innovation along with efforts to ensure fair competition.

The ministry said Kim, during a session, introduced Korea's strategy for supporting the semiconductor industry and urged partners to join efforts to build a stable and predictable business environment to jointly ensure the resilience of semiconductor supply chains.

The vice minister also reaffirmed Seoul's commitment to contributing to the creation of an innovation-friendly global business environment involving AI supply chains, the ministry said.


Yonhap